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0117 4.0 W/M·K Silicone Thermally Conductive Compound Heat Transfer Medium For Electronic Components , CPU IGBT

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0117 4.0 W/M·K Silicone Thermally Conductive Compound Heat Transfer Medium For Electronic Components , CPU IGBT

Name: 0117 40 WMK Silicone Thermally Conductive Compound Heat Transfer Medium For Electronic Components CPU IGBT
Brand: HUITIAN
Price: 1 USD

Quality 0117 4.0 W/M·K Silicone Thermally Conductive Compound Heat Transfer Medium For Electronic Components , CPU IGBT wholesale

Brand Name : HUITIAN

Model Number : 0117

Certification : SGS

Place of Origin : China

MOQ : 100KG

Price : Negotiation

Payment Terms : T/T, L/C

Supply Ability : 5000kg/Month

Delivery Time : 5-8 days

Packaging Details : 1kg/barrel

Physical Form : Paste

Color : Gray

Viscosity, ASTM D2196 : 180,000 mPa·s

Density, ASTM D792 : 3.3±0.2

Minimum interface thickness : 14.9 μm

Thermal Conductivity, ASTM D5470 : 4.0±10% W/ m·K

Work Temperature : -50~150 ℃

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0117 TDS-EN.pdf

Product Description

Silicone thermally conductive compound
Gray paste
Non-curing type

Product Features

Thermal conductivity: 4.0 W/ m·K
It contains metal powder to enhance thermal conductivity and non-insulating
Very small interface thickness and very low interface thermal resistance
Proper viscosity and proper thixotropy for fast large-area screen printing or hand-painting
No residual stress after gluing effectively protects precision electronic components from damage

Typical applications

Widely used as a heat transfer medium for electronic components, such as CPU, IGBT, automotive electronics, LED lighting, large storage devices, smartphone modules, consumer electronics, etc.

Directions for use

It is recommended to pre-stir the product which has been placed for a long time before use.
Test confirm with a sample before applying the product to the material.
Before use, clean the surface to be applied and remove oil and dirt.
The sizing surface should be even and consistent, as long as a thin layer is applied.
To avoid being polluted by dust and other impurities, the product should not be exposed to the air for a long time.

Technical parameters

Reference standard	Item	Unit	Value
ASTM D792	Density	g/cm³	3.3±0.2
ASTM D2196	Viscosity	mPa·s	180,000
	Minimum interface thickness	μm	14.9
ASTM D5470	Thermal resistance @12psi	℃∙cm²/W	0.11
ASTM D5470	Thermal resistance @40psi	℃∙cm²/W	0.07
ASTM D5470	Thermal conductivity	W/ m·K	4.0±10%
ISO22007	Thermal conductivity	W/ m·K	4.7±10%
	Long-term operating temperature	℃	-50~150

Cautions

Keep away from children for storage.

On the premise of filling the gap, the thinner the coating, the better.

If the skin is accidentally exposed to the product, wipe clean and rinse with water.

If the eyes are accidentally exposed to the product, rinse immediately with plenty of water and seek medical examination.

Please consult the MSDS of the product for details.

Storage

Store at 8-28°C in a cool and dry place.

Shelf life is 12 months.

Packing specification

Order code: Shanghai, 011711;

Net weight 1000±5g

0117 4.0 W/M·K Silicone Thermally Conductive Compound Heat Transfer Medium For Electronic Components , CPU IGBT

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0117 4.0 W/M·K Silicone Thermally Conductive Compound Heat Transfer Medium For Electronic Components , CPU IGBT Images

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0117 4.0 W/M·K Silicone Thermally Conductive Compound Heat Transfer Medium For Electronic Components , CPU IGBT

0117 4.0 W/M·K Silicone Thermally Conductive Compound Heat Transfer Medium For Electronic Components , CPU IGBT

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